Special filler for leveling critical substrates under top coverings Fiber-reinforced, reduces cracking on wooden floors. Runs easily, therefore requires little work to process. Hardens quickly, therefore after approx. Can be walked on for 3 hours (at + 23 °C and 50% relative humidity). Low dust, less dust formation when opening, pouring and mixing. For indoor use under a seal combined with tiles and panels For leveling wooden floorboards, OSB boards, chipboard, mineral substrates, non-absorbent substrates, mastic asphalt. Before laying ceramic and natural stone coverings, textile and elastic floor coverings, parquet or laminate to be glued. Suitable for hot water underfloor heating systems, recommended for thin-layer embedding. Always read the label and product information before.